5 Specifications

5.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VPUP

DC voltage applied to data

–0.3

5.5

V

IOL

Low-level output current

30

mA

TSTG

Storage temperature

–40

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and may affect device reliability, functionality, performance, and shorten device lifetime.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±250

ESD IEC 61000-4-2 Air discharge, SDQ and GND

±15000

V

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. .

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VPUP

Operational pull-up voltage

3.13

5.25

V

RPUP

Serial Communication interface pull-up resistance

500

Ω

TA

Operating free-air temperature

-10

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

TMF0008

UNIT

DRS (WSON)

PS (SO)

TO-92 (LP)

6 PINS

8 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

70.2

109.9

133.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.5

55.6

99.2

°C/W

RθJB

Junction-to-board thermal resistance

38.2

61.6

103.5

°C/W

ψJT

Junction-to-top characterization

parameter

2.2

16.4

28.4

°C/W

ψJB

Junction-to-board characterization

parameter

38.2

60.6

103.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

11.0

-

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

TMF0008

SLVSIV3 – JULY 2025

www.ti.com

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