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EXAMPLE STENCIL DESIGN

8X (1.55)

8X (0.6)

(5.4)

6X (1.27)

(R0.05) TYP

(2.287)

(2.287)

BASED ON

0.127 THICK

STENCIL

4218820/A 12/2022

PowerPAD

SOIC - 1.7 mm max height

DDA0008D

PLASTIC SMALL OUTLINE

1.933 X 1.933

0.175

2.088 X 2.088

0.150

2.287 X 2.287 (SHOWN)

0.125

2.557 X 2.557

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

SYMM

SYMM

1

4

5

8

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES