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EXAMPLE STENCIL DESIGN

(R0.05) TYP

8X (1.55)

8X (0.6)

6X (1.27)

(5.4)

(2.71)

(3.4)

BASED ON

0.125 THICK

STENCIL

4214849/B 09/2025

PowerPAD

SOIC - 1.7 mm max height

DDA0008B

PLASTIC SMALL OUTLINE

2.29 X 2.87

0.175

2.47 X 3.10

0.150

2.71 X 3.40 (SHOWN)

0.125

3.03 X 3.80

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

SYMM

SYMM

1

4

5

8

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

9