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LP2998MA/NOPB 数据表(PDF) 1 Page - Texas Instruments |
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LP2998MA/NOPB 数据表(HTML) 1 Page - Texas Instruments |
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1 / 42 page ![]() VTT LP2998 PVIN VDDQ VREF AVIN VREF = 0.75V VSENSE GND + + + VDDQ = 1.5V VDD = 2.5V VTT = 0.75V SD SD CIN COUT CREF Product Folder Sample & Buy Technical Documents Tools & Software Support & Community LP2998, LP2998-Q1 SNVS521K – DECEMBER 2007 – REVISED AUGUST 2014 LP2998/LP2998-Q1 DDR Termination Regulator 1 Features 3 Description The LP2998 linear regulator is designed to meet 1 • AEC-Q100 Test Guidance with the following JEDEC SSTL-2 and JEDEC SSTL-18 specifications results (SO PowerPAD-8): for termination of DDR-SDRAM and DDR2 memory. – Device HBM ESD Classification Level H1C The device also supports DDR3 and DDR3L VTT bus – Junction Temperature Range –40°C to 125°C termination with VDDQ min of 1.35 V. The device contains a high-speed operational amplifier to provide • 1.35 V Minimum VDDQ excellent response to load transients. The output • Source and Sink Current stage prevents shoot through while delivering 1.5 A • Low Output Voltage Offset continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM • No External Resistors Required termination. The LP2998 also incorporates a • Linear Topology VSENSE pin to provide superior load regulation and • Suspend to Ram (STR) Functionality a VREF output as a reference for the chipset and DIMMs. • Low External Component Count • Thermal Shutdown An additional feature found on the LP2998 is an active low shutdown (SD) pin that provides Suspend 2 Applications To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high • DDR1, DDR2, DDR3, and DDR3L Termination impedance output, but, VREF will remain active. A Voltage power savings advantage can be obtained in this • Automotive Infotainment mode through lower quiescent current. • FPGA Device Information(1) • Industrial/Medical PC PART NUMBER PACKAGE BODY SIZE (NOM) • SSTL-18, SSTL-2, and SSTL-3 Termination LP2998 SO PowerPAD™ (8) 4.89 mm x 3.90 mm • HSTL Termination LP2998 SOIC (8) 4.90 mm x 3.91 mm LP2998-Q1 SO PowerPAD™ (8) 4.89 mm x 3.90 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 4 Simplified Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
类似零件编号 - LP2998MA/NOPB |
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