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M41ST85W

Maximum ratings

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Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Caution:

Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup

mode.

Caution:

Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Table 8. Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC off, oscillator

off)

SNAPHAT®

–40 to 85

°C

SOIC

–55 to 150

°C

TSLD

Lead solder temperature for 10 seconds

SOH28(1)

1. For SOH28 package, lead-free (pb-free) lead finish: reflow at peak temperature of 260°C (the time above

255°C must not exceed 30 seconds).

260

°C

SOX28(2)

2. The SOX28 package has lead-free (pb-free) lead finish, but cannot be exposed to peak reflow temperature

in excess of 240°C. Reflow at peak temperature of 240°C (the time above 235°C must not exceed 20

seconds).

240

°C

VIO

Input or output voltage

–0.3 to VCC+0.3

V

VCC

Supply voltage

–0.3 to 4.6

V

IO

Output current

20

mA

PD

Power dissipation

1

W