Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................3

Pin Functions.................................................................... 3

7 Specifications.................................................................. 4

7.1 Absolute Maximum Ratings........................................ 4

7.2 ESD Ratings............................................................... 4

7.3 Recommended Operating Conditions.........................4

7.4 Thermal Information....................................................4

7.5 Electrical Characteristics.............................................5

7.6 Typical Characteristics................................................ 6

8 Parameter Measurement Information.......................... 13

8.1 Solder Heat Shift.......................................................13

8.2 Long-Term Stability................................................... 14

8.3 Thermal Hysteresis................................................... 15

8.4 Noise Performance................................................... 16

9 Detailed Description......................................................17

9.1 Overview................................................................... 17

9.2 Functional Block Diagram......................................... 17

9.3 Feature Description...................................................17

9.4 Device Functional Modes..........................................18

10 Applications and Implementation.............................. 19

10.1 Application Information........................................... 19

10.2 Typical Application.................................................. 20

11 Power-Supply Recommendations..............................25

12 Layout...........................................................................26

12.1 Layout Guidelines................................................... 26

12.2 Layout Example...................................................... 26

13 Device and Documentation Support..........................27

13.1 Documentation Support.......................................... 27

13.2 Receiving Notification of Documentation Updates..27

13.3 Support Resources................................................. 27

13.4 Trademarks.............................................................27

13.5 Electrostatic Discharge Caution..............................27

13.6 Glossary..................................................................27

14 Mechanical, Packaging, and Orderable

Information.................................................................... 27

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (May 2018) to Revision E (January 2022)

Page

• Updated Applications section............................................................................................................................. 1

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Changed ESD Rating table: changed HBM rating from ±4000 V to ±2500 V.....................................................4

• Updated Long-term stability value...................................................................................................................... 5

• Added Long-Term Stability sub-section under Parameter Measurement Information section..........................14

Changes from Revision C (January 2017) to Revision D (May 2018)

Page

• Changed application information to include corrosion resistance advantages. ............................................... 19

Changes from Revision B (July 2014) to Revision C (January 2017)

Page

• Added I/O column to Pin Functions table .......................................................................................................... 3

• Added Storage temperature parameter to Absolute Maximum Ratings table (moved from ESD Ratings table)

............................................................................................................................................................................4

• Changed ESD Rating table: changed title, updated table format ...................................................................... 4

Changes from Revision A (June 2014) to Revision B (July 2014)

Page

• Changed device status to Production Data from Mixed Status ......................................................................... 1

• Deleted footnote 2 from Device Information table ............................................................................................. 1

• Deleted footnote from Device Comparison Table .............................................................................................. 3

• Added Thermal Information table....................................................................................................................... 4

Changes from Revision * (May 2014) to Revision A (June 2014)

Page

• Made changes to product preview data sheet.................................................................................................... 1

REF2025, REF2030, REF2033, REF2041

SBOS600E – JULY 2018 – REVISED FEBRUARY 2022

www.ti.com

2

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: REF2025 REF2030 REF2033 REF2041