7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

VIN

–0.3

6

V

EN

–0.3

VIN + 0.3

Temperature

Operating

–55

150

°C

Junction, Tj

150

Storage, Tstg

–65

170

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Supply input voltage range (IL = 0 mA, TA = 25°C)

VREF + 0.02(1)

5.5

V

(1)

See Figure 7-28 in Section 7.6 for minimum input voltage at different load currents and temperature

7.4 Thermal Information

THERMAL METRIC(1)

REF20xx

UNIT

DDC (SOT23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

193.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

40.2

°C/W

RθJB

Junction-to-board thermal resistance

34.5

°C/W

ψJT

Junction-to-top characterization parameter

0.9

°C/W

ψJB

Junction-to-board characterization parameter

34.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

REF2025, REF2030, REF2033, REF2041

SBOS600E – JULY 2018 – REVISED FEBRUARY 2022

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