7.6 Typical Characteristics (continued)

At TA = 25°C, IL = 0 mA, VIN = 5-V power supply, CL = 0 µF, and 2.5-V output, unless otherwise noted.

0

10

20

30

40

50

60

0

1

2

3

4

5

6

7

VREF and VBIAS Tracking Over Temperature (ppm/ƒC)

C017

–40°C ≤ TA ≤ 125°C

Figure 7-7. Distribution of VREF – 2 × VBIAS Drift Tracking Over

Temperature

0

10

20

30

40

50

-0.0125

-0.01

-0.0075 -0.005 -0.0025

0

0.0025

Solder Heat Shift Histogram - V

REF (%)

C041

Refer to the Section 8.1 section for more information.

Figure 7-8. Solder Heat Shift Distribution (VREF)

0

10

20

30

40

50

60

-0.0125

-0.01

-0.0075 -0.005 -0.0025

0

0.0025

Solder Heat Shift Histogram - VBIAS (%)

C040

Refer to the Section 8.1 section for more information.

Figure 7-9. Solder Heat Shift Distribution (VBIAS)

-0.05

-0.04

-0.03

-0.02

-0.01

0

0.01

0.02

0.03

0.04

0.05

±75

±50

±25

0

25

50

75

100

125

150

Temperature (ƒC)

C001

VREF

V

BIAS

Figure 7-10. Output Voltage Accuracy (VREF) vs Temperature

±1000

±750

±500

±250

0

250

500

750

1000

±75

±50

±25

0

25

50

75

100

125

150

Temperature (ƒC)

C003

Figure 7-11. VREF – 2 × VBIAS Tracking vs Temperature

2.4980

2.4985

2.4990

2.4995

2.5000

2.5005

±20

±15

±10

±5

0

5

10

15

20

Load Current (mA)

C038

125°C

25°C

-40°C

VREF output

Figure 7-12. Output Voltage Change vs Load Current (VREF)

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