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REF2025 数据表(PDF) 13 Page - Texas Instruments

部件名 REF2025
功能描述  REF20xx Low-Drift, Low-Power, Dual-Output, VREF and VREF / 2 Voltage References
PDF  37 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

REF2025 数据表(HTML) 13 Page - Texas Instruments

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8 Parameter Measurement Information
8.1 Solder Heat Shift
The materials used in the manufacture of the REF20xx have differing coefficients of thermal expansion, resulting
in stress on the device die when the part is heated. Mechanical and thermal stress on the device die can cause
the output voltages to shift, degrading the initial accuracy specifications of the product. Reflow soldering is a
common cause of this error.
In order to illustrate this effect, a total of 92 devices were soldered on four printed circuit boards [23 devices
on each printed circuit board (PCB)] using lead-free solder paste and the paste manufacturer suggested reflow
profile. The reflow profile is as shown in Figure 8-1. The printed circuit board is comprised of FR4 material. The
board thickness is 1.57 mm and the area is 171.54 mm × 165.1 mm.
The reference and bias output voltages are measured before and after the reflow process; the typical shift is
displayed in Figure 8-2 and Figure 8-3. Although all tested units exhibit very low shifts (< 0.01%), higher shifts
are also possible depending on the size, thickness, and material of the printed circuit board. An important note is
that the histograms display the typical shift for exposure to a single reflow profile. Exposure to multiple reflows,
as is common on PCBs with surface-mount components on both sides, causes additional shifts in the output bias
voltage. If the PCB is exposed to multiple reflows, the device should be soldered in the second pass to minimize
its exposure to thermal stress.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
350
400
Time (seconds)
C01
Figure 8-1. Reflow Profile
0
10
20
30
40
50
-0.0125
-0.01
-0.0075 -0.005 -0.0025
0
0.0025
Solder Heat Shift Histogram - V
REF (%)
C041
Figure 8-2. Solder Heat Shift Distribution, VREF (%)
0
10
20
30
40
50
60
-0.0125
-0.01
-0.0075 -0.005 -0.0025
0
0.0025
Solder Heat Shift Histogram - VBIAS (%)
C040
Figure 8-3. Solder Heat Shift Distribution, VBIAS (%)
www.ti.com
REF2025, REF2030, REF2033, REF2041
SBOS600E – JULY 2018 – REVISED FEBRUARY 2022
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
13
Product Folder Links: REF2025 REF2030 REF2033 REF2041



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