STTH4R02-Y

Characteristics

DocID17391 Rev 2

5/14

Figure 11: Dynamic parameters versus junction

temperature

Figure 12: Thermal resistance, junction to ambient,

versus copper surface under tab

Figure 13: Thermal resistance, junction to ambient,

versus copper surface under each lead

Figure 14: Thermal resistance, junction to ambient,

versus copper surface under each lead

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

25

50

75

100

125

150

QRR; IRM [Tj] / QRR; IRM [Tj = 125 °C]

IRM

dlF/dt (A/µs)

I

F = 4 A

V

R = 160 V

QRR

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

DPAK

Epoxy printed board FR4, eCU= 35 µm

90

100

0

20

40

60

80

100

120

140

160

180

200

0

1

2

3

4

5

6

7

8

9

10

Rth(j-a)(°C/W)

S

CU(cm²)

SMB

Epoxy printed board FR4, copper thickness = 35 µm

0

20

40

60

80

100

120

140

160

0

1

2

3

4

5

6

7

8

9

10

Rth(j-a)(°C/W)

S

CU(cm²)

SMC

Epoxy printed board FR4, copper thickness = 35 µm