Data Sheet

ADPA1120

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 19

Table 4. Absolute Maximum Ratings

Parameter

Rating

Bias Voltage

Drain (VDD1-2, VDD3, and VDD4)

35V DC

Gate (VGG1-2, VGG3, and VGG4)

−8V DC to 0V DC

Continuous Wave RF Input Power (RFIN)

12dBm

Maximum Power Dissipation, PDISS

Drain Bias Pulse Width = 100μs at 10% Duty Cycle,

TCASE = 85°C

17W

Continuous Drain Bias, TCASE = 85°C

14W

Temperature

Maximum Channel

225°C

Storage Range

−65°C to +150°C

Operating Range

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case thermal resistance.

Table 5. Thermal Resistance

Package Type1, 2

Pulsed 10% Duty Cycle, 100μs

Pulse Width, θJC

Continuous

Wave θJC

Unit

CP-32-13

8.20

10

°C/W

1 θJC was determined under the following conditions: the heat transfer is due

solely to the thermal conduction from the channel through the ground pad to

the PCB, and the ground pad is held constant at the operating temperature of

85°C.

2 Drain bias pulse width = 100µs at 10% duty cycle.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA1120

Table 6. ADPA1120, 32-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

200

0B

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.