NRF51822-CFAB-R datasheet(39/130 Pages) NORDIC

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Page 39

nRF51822 Product Specification v3.3

Operating conditions

The operating conditions are the physical parameters that the chip can operate within as defined in

Table 20.

Table 20 Operating conditions

Nominal operating conditions (NOC) - conditions under which the chip is operated and tested are the

typical (Typ.) values in Table 20.

Extreme operating conditions (EOC) - conditions under which the chip is operated and tested are the

minimum (Min.) and maximum (Max.) values in Table 20.

7.1

WLCSP light sensitivity

7.1.1

CDAB, CEAA, and CFAC light sensitivity

The CDAB, CEAA, and CFAC package variants are sensitive to visible and near infrared light which means a

final product design must shield the chip properly. The marking side is covered with a light absorbing film,

while the side edges of the chip and the ball side must be protected by coating or other means.

7.1.2

CTAA and CTAC light sensitivity

The CTAA and CTAC package variant is sensitive to visible and close-range infrared light which means a final

product design must shield the chip properly. Unlike the other WLCSP variants that have some protection,

the CTAA and CTAC variant does not have any and therefore must be protected by light absorbing film

coating or other means.

7.2

CTAA and CTAC mechanical strength

The CTAA and CTAC is a thinner variant of the WLCSP package. To ensure a mechanical robust solution the

customer is recommended to perform board level bending validation test.

Symbol

Parameter

Notes

Min.

Typ.

Max.

Units

VDD

Supply voltage, internal LDO setup

1.8

3.0

3.6

VDD

Supply voltage, DC/DC converter setup

2.1

3.0

3.6

VDD

Supply voltage, low voltage mode

setup

1. DEC2 shall be connected to VDD in this mode.

1.75

1.8

1.95

tR_VDD

Supply rise time (0 V to VDD)

2. The on-chip power-on reset circuitry may not function properly for rise times outside the specified interval.

100

Operating temperature

-25

°C

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