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NRF51822-CFAB-R 数据表(PDF) 9 Page - Nordic Semiconductor

部件名 NRF51822-CFAB-R
功能描述  Multiprotocol Bluetooth® low energy/2.4 GHz RF System on Chip
PDF  130 Pages
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制造商  NORDIC [Nordic Semiconductor]
网页  https://www.nordicsemi.com/
标志 NORDIC - Nordic Semiconductor

NRF51822-CFAB-R 数据表(HTML) 9 Page - Nordic Semiconductor

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Page 9
nRF51822 Product Specification v3.3
8.8
Serial Peripheral Interface Slave (SPIS) specifications .......................................................................57
8.9
Serial Peripheral Interface (SPI) Master specifications ......................................................................58
8.10
I2C compatible Two Wire Interface (TWI) specifications..................................................................59
8.11
GPIO Tasks and Events (GPIOTE) specifications...................................................................................60
8.12
Analog to Digital Converter (ADC) specifications...............................................................................61
8.13
Timer (TIMER) specifications.......................................................................................................................62
8.14
Real Time Counter (RTC) ..............................................................................................................................62
8.15
Temperature sensor (TEMP) .......................................................................................................................62
8.16
Random Number Generator (RNG) specifications..............................................................................63
8.17
AES Electronic Codebook Mode Encryption (ECB) specifications.................................................63
8.18
AES CCM Mode Encryption (CCM) specifications ...............................................................................63
8.19
Accelerated Address Resolver (AAR) specifications...........................................................................63
8.20
Watchdog Timer (WDT) specifications ...................................................................................................64
8.21
Quadrature Decoder (QDEC) specifications .........................................................................................64
8.22
Non-Volatile Memory Controller (NVMC) specifications..................................................................65
8.23
General Purpose I/O (GPIO) specifications ............................................................................................66
8.24
Low Power Comparator (LPCOMP) specifications..............................................................................66
9
Mechanical specifications ..................................................................................................................... 67
9.1
QFN48 package ...............................................................................................................................................67
9.2
CDAB WLCSP package ..................................................................................................................................68
9.3
CEAA WLCSP package...................................................................................................................................69
9.4
CFAC WLCSP package...................................................................................................................................70
9.5
CTAA WLCSP package...................................................................................................................................71
9.6
CTAC WLCSP package...................................................................................................................................72
10
Ordering information ............................................................................................................................ 73
10.1
Chip marking....................................................................................................................................................73
10.2
Inner box label.................................................................................................................................................73
10.3
Outer box label................................................................................................................................................74
10.4
Order code ........................................................................................................................................................74
10.5
Abbreviations...................................................................................................................................................75
10.6
Code ranges and values ...............................................................................................................................76
10.7
Product options ..............................................................................................................................................78
11
Reference circuitry.................................................................................................................................. 79
11.1
PCB guidelines.................................................................................................................................................79
11.2
Reference design schematics.....................................................................................................................81
11.3
QFAA QFN48 package ..................................................................................................................................82
11.4
QFAB QFN48 package...................................................................................................................................88
11.5
QFAC QFN48 package...................................................................................................................................94
11.6
CDAB WLCSP package ............................................................................................................................... 100
11.7
CEAA WLCSP package................................................................................................................................ 106
11.8
CFAC WLCSP package................................................................................................................................ 112
11.9
CTAA WLCSP package................................................................................................................................ 118
11.10
CTAC WLCSP package................................................................................................................................ 124
12
Glossary ..................................................................................................................................................130



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