CC2564MODACMOG datasheet(2/68 Pages) TI2

2 / 68 page

CC2564MODN, CC2564MODA

SWRS160E – FEBRUARY 2014 – REVISED JANUARY 2017

www.ti.com

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Product Folder Links: CC2564MODN CC2564MODA

Device Overview

1.2

Applications

•

Mobile Accessories

•

Sports and Fitness Applications

•

Wireless Audio Solutions

•

Set-Top Boxes and Remote Controls

•

Toys

•

Test and Measurement

•

Industrial: Cable Replacement

•

Wireless Sensors

•

Automotive Aftermarket

•

Wellness and Health

(1)

For more information on these devices, see Section 8.2.

1.3

Description

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy

HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's

seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant.

The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this

device; and the device includes a royalty-free software stack compatible with several host MCUs and

MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive

sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only

solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings

in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and

MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors

can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software

packages. Multiple profiles and sample applications, including the following, are supported:

•

Serial port profile (SPP)

•

Advanced audio distribution profile (A2DP)

•

Audio/video remote control profile (AVRCP)

•

Hands-free profile (HFP)

•

Human interface device (HID)

•

Generic attribute profile (GATT)

•

Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available

for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-

connectivity/dual-mode-bluetooth page.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE

CC2564MODNCMOET

MOE (33)

7.0 mm × 7.0 mm × 1.4 mm (Typical)

CC2564MODNCMOER

MOE (33)

7.0 mm × 7.0 mm × 1.4 mm (Typical)

CC2564MODACMOG

MOG (35)

7.0 mm × 14.0 mm × 1.4 mm (Typical)

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CC2564MODACMOG 数据表(PDF) 2 Page - Texas Instruments

CC2564MODACMOG 数据表(HTML) 2 Page - Texas Instruments

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