CC2564MODACMOG datasheet(8/68 Pages) TI2

8 / 68 page

CC2564MODN, CC2564MODA

SWRS160E – FEBRUARY 2014 – REVISED JANUARY 2017

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Product Folder Links: CC2564MODN CC2564MODA

Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Analog pin: BT_ANT

(3)

The module supports a temperature range of –30°C to +85°C because of the operating conditions of the crystal.

Specifications

Unless otherwise indicated, all measurements are taken at the device pins of the TI test evaluation board

(EVB). All specifications are over process, voltage, and temperature, unless otherwise indicated.

All values apply to the CC2564MODA and CC2564MODN devices, unless otherwise indicated.

4.1

Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise indicated). All parameters are measured as follows: VDD_IN =

3.6 V and VDD_IO = 1.8 V (unless otherwise indicated).

(1)

MIN

MAX

UNIT

VDD_IN

Supply voltage

–0.5

4.8

VDD_IO

–0.5

2.145

Input voltage to analog pins(2)

–0.5

2.1

Input voltage to all other pins

–0.5

VDD_IO + 0.5

Operating ambient temperature(3)

–30

°C

Bluetooth RF inputs

dBm

Tstg

Storage temperature

–40

100

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4.2

ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±500

Charged device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

This information is provided solely to give the customer an estimation of the POH under certain specified conditions, and is not intended

to – and does not – extend the warranty for the device under TI’s Standard Terms and Conditions.

4.3

Power-On Hours

(1)

DEVICE

CONDITIONS

POWER-ON HOURS

CC2564MODx

Duty cycle = 25% active and 75% sleep

TA = 70ºC

15,400 (7 years)

(1)

A crystal-based solution is limited by the temperature range required for the crystal to meet 20 ppm.

4.4

Recommended Operating Conditions

MIN

MAX

UNIT

VDD_IN

Power supply voltage

2.2

4.8

VDD_IO

I/O power supply voltage

1.62

1.92

VIH

High-level input voltage

Condition: Default

0.65 × VDD_IO

VDD_IO

VIL

Low-level input voltage

Condition: Default

0.35 ×

VDD_IO

tr and tf

I/O input rise and fall times,10% to 90% — asynchronous mode

I/O input rise and fall times, 10% to 90% — synchronous mode

(PCM)

2.5

Voltage dips on VDD_IN (V(BAT))

duration = 577 µs to 2.31 ms, period = 4.6 ms

400

Maximum ambient operating temperature (1)

–30

°C

CC2564MODACMOG 数据表(PDF) 8 Page - Texas Instruments

CC2564MODACMOG 数据表(HTML) 8 Page - Texas Instruments

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CC2564MODACMOG 数据表(PDF) 8 Page - Texas Instruments

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