MIC24054

DS20007043B-page 32

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2025-2026 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

28-Lead Very Thin Plastic Quad Flat, No Lead Package (PKA) - 5x6x0.9 mm Body [VQFN]

With Multiple Exposed Pads and Fused Terminals; Micrel Legacy QFN56-28LD-PL-1

Microchip Technology Drawing C04-1120 Rev A

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L1

E

N

0.65 BSC

0.20 REF

2.90

0.35

0.25

0.00

0.80

0.30

0.40

2.95

0.02

0.85

6.00 BSC

MILLIMETERS

MIN

NOM

28

3.00

0.45

0.35

0.05

0.85

MAX

K1

0.25 REF

Terminal to Exposed Pad

Overall Length

Exposed Pad Length

D

D2

2.15

5.00 BSC

2.20

2.25

K2

0.575 REF

Body Edge to Exposed Pad

K3

0.035 REF

Exposed Pad to Exposed Pad

K4

0.40 REF

Exposed Pad Offset

Terminal Length

L2

0.45 REF

Terminal Length

L3

0.15 REF

Exposed Pad Width

E3

1.575

1.60

1.625

Exposed Pad Length

D3

1.35

1.40

1.45

Exposed Pad Length

D4

3.65

3.70

3.75

K5

0.35 REF

Exposed Pad to Exposed Pad

Exposed Pad Width

E4

2.45

Exposed Pad Width

E5

2.90

2.40

2.50

2.85

2.95