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2025-2026 Microchip Technology Inc. and its subsidiaries

DS20007043B-page 11

MIC24054

FIGURE 2-30:

Thermal Derating* vs.

Ambient Temperature.

FIGURE 2-31:

Thermal Derating* vs.

Ambient Temperature.

FIGURE 2-32:

Thermal Derating* vs.

Ambient Temperature.

FIGURE 2-33:

Thermal Derating* vs.

Ambient Temperature.

FIGURE 2-34:

VIN Soft Turn-On.

FIGURE 2-35:

VIN Turn-Off.

*Thermal Derating: The temperature measurement was taken at the hottest point on the MIC24054 case mounted on

a 5 square inch, 4 layer PCB, tested in ambient temperature of 23°C to 25°C in open space with no forced cooling; see

the Thermal Measurements section. Actual results will depend upon the size of the PCB, ambient temperature, and

proximity to other heat-emitting components.

0

2

4

6

8

10

12

14

-50

-25

0

25

50

75

100

125

AMBIENT TEMPERATURE (°C)

1.5V

0.8V

VIN = 5V

VOUT = 0.8, 1.2, 1.5V

0

2

4

6

8

10

12

14

-50

-25

0

25

50

75

100

125

AMBIENT TEMPERATURE (°C)

3.3V

1.8V

VIN = 5V

VOUT = 1.8, 2.5, 3.3V

0

2

4

6

8

10

12

14

-50

-25

0

25

50

75

100

125

AMBIENT TEMPERATURE (°C)

VIN = 12V

VOUT = 0.8, 1.2, 1.8V

1.8V

0.8V

0

2

4

6

8

10

12

14

-50-25

0

25

50

75100

125

AMBIENT TEMPERATURE (°C)

VIN = 12V

VOUT = 2.5, 3.3, 5V

5V

2.5V

V

IN = 12V

V

OUT = 1.8V

I

OUT = 9A

V

IN

(10V/div)

V

SW

(10V/div)

V

OUT

(2V/div)

I

L

(10A/div)

Time (2ms/div)

V

IN = 12V

V

OUT = 1.8V

I

OUT = 9A

V

IN

(10V/div)

V

SW

(10V/div)

V

OUT

(2V/div)

I

L

(10A/div)

Time (1ms/div)