APM32F103C8T6-R datasheet(6/78 Pages) GEEHY

6 / 78 page

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P a g e 5

5.7.7 Backup Domain Power Consumption...................................................................................................... 41

5.8

Wake-up time in low-power mode ........................................................................................................... 41

5.9

I/O port characteristics............................................................................................................................. 41

5.10

NRST pin characteristics ......................................................................................................................... 44

5.11

Communication peripherals..................................................................................................................... 45

5.11.1 I2C peripheral characteristics .................................................................................................................. 45

5.11.2 SPI peripheral characteristics.................................................................................................................. 46

5.11.3 USBD peripheral characteristics ............................................................................................................. 49

5.12

Analog peripherals................................................................................................................................... 51

5.12.1 ADC ......................................................................................................................................................... 51

5.13

Temperature sensor characteristics ........................................................................................................ 54

Package information ............................................................................................................................. 55

6.1

LQFP100 Package Diagram.................................................................................................................... 55

6.2

LQFP64 Package Diagram...................................................................................................................... 58

6.3

LQFP48 Package Diagram...................................................................................................................... 61

6.4

QFN36 Package Diagram ....................................................................................................................... 64

Packaging Information.......................................................................................................................... 67

7.1

Reel Packaging........................................................................................................................................ 67

7.2

Tray packaging ........................................................................................................................................ 69

Ordering Information............................................................................................................................. 71

Commonly Used Function Module Denomination ............................................................................. 73

Version history....................................................................................................................................... 74

APM32F103C8T6-R 数据表(PDF) 6 Page - Geehy Semiconductor Co., Ltd.

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