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MPC855T 数据表(PDF) 74 Page - Freescale Semiconductor, Inc |
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MPC855T 数据表(HTML) 74 Page - Freescale Semiconductor, Inc |
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74 / 80 page ![]() MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8 74 Freescale Semiconductor Mechanical Data and Ordering Information 14.2 Mechanical Dimensions of the PBGA Package Figure 77 shows the mechanical dimensions of the ZP PBGA package. Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SIDE VIEW BOTTOM VIEW 18X 4X 357X b TOP VIEW A2 A3 e 0.3 M C D A A1 D2 0.15 M C E E2 0.2 C A B 0.2 D1 E1 AB 0.25 C 0.35 C C NOTE 1. Dimensions and tolerance per ASME Y14.5M, 1994. 2. Dimensions in millimeters. 3. Dimension b is the maximum solder ball diameter measured parallel to data C. DIM MIN MAX MILLIMETERS A --- 2.05 0.50 0.70 A2 0.95 1.35 A3 0.70 0.90 b 0.60 0.90 D 25.00 BSC D1 22.86 BSC D2 22.40 22.60 e 1.27 BSC E 25.00 BSC E1 22.86 BSC E2 22.40 22.60 A1 |
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