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MPC855T 数据表(PDF) 8 Page - Freescale Semiconductor, Inc |
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MPC855T 数据表(HTML) 8 Page - Freescale Semiconductor, Inc |
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8 / 80 page ![]() MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8 8 Freescale Semiconductor Thermal Characteristics Figure 1 shows the undershoot and overshoot voltages at the interface of the MPC860. Figure 1. Undershoot/Overshoot Voltage for VDDH and VDDL 4 Thermal Characteristics Table 3. Package Description Package Designator Package Code (Case No.) Package Description ZP 5050 (1103-01) PBGA 357 25*25*0.9P1.27 ZQ/VR 5058 (1103D-02) PBGA 357 25*25*1.2P1.27 GND GND – 0.3 V GND – 0.7 V Not to Exceed 10% VDDH/VDDL + 20% VDDH/VDDL VDDH/VDDL + 5% of tinterface 1 1. tinterface refers to the clock period associated with the bus clock interface. VIH VIL Note: |
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