ST7LITE3XF2 datasheet(160/173 Pages) STMICROELECTRONICS

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ST7LITE3xF2

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Figure 107. 20-Pin Plastic Dual In-Line Package, 300-mil Width

14.2 THERMAL CHARACTERISTICS

Notes:

The maximum chip-junction temperature is based on technology characteristics.

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipa-

tion of an application is defined by the user with the formula: PD = PINT + PPORT where PINT is the chip

internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the

application.

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

(junction to ambient)

DIP20

°C/W

SO20

TJmax

Maximum junction temperature 1)

150

°C

PDmax

Maximum power dissipation 2)

DIP20

400

SO20

330

Dim.

inches1)

Min

Typ

Max

Min

Typ

Max

5.33

0.2098

0.38

0.0150

2.92

3.30

4.95 0.1150 0.1299 0.1949

0.36

0.46

0.56 0.0142 0.0181 0.0220

1.14

1.52

1.78 0.0449 0.0598 0.0701

0.20

0.25

0.36 0.0079 0.0098 0.0142

24.89 26.16 26.92 0.9799 1.0299 1.0598

0.13

0.0051

2.54

0.1000

10.92

0.4299

6.10

6.35

7.11 0.2402 0.2500 0.2799

2.92

3.30

3.81 0.1150 0.1299 0.1500

Number of Pins

Note 1. Values in inches are converted from mm and

rounded to 4 decimal digits.

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