STA335BWS datasheet(64/68 Pages) STMICROELECTRONICS

64 / 68 page

Package thermal characteristics

STA335BWS

64/68

Package thermal characteristics

Using a triple-layer PCB the thermal resistance (junction to ambient) with a center copper

ground area of 3 x 3 cm2 and with 16 via holes (see Figure 20) is 24° C/W in natural air

convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

The max estimated dissipated power for the STA335BWS is:

Figure 20.

Triple-layer PCB with copper ground area and 16 via holes

Figure 21 shows the power derating curves for the PowerSSO-36 package on a board with

two different sizes of copper layers.

Figure 21.

PowerSSO-36 power derating curve

2 x 20 W @ 8

Ω, 18 V

Pd max ~ 4 W

2 x 10 W + 1 x 20 W @ 4

Ω, 8 Ω, 18 V

Pd max < 5 W

100

120

140

160

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA335BW

PSSO36

Copper Area 3x3 cm

and via holes

STA335BWS

PowerSSO-36

STA335BWS 数据表(PDF) 64 Page - STMicroelectronics

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