STW5095 datasheet(71/73 Pages) STMICROELECTRONICS

部件名	STW5095

功能描述	Low-power asynchronous stereo audio Codec with integrated power amplifiers

PDF	73 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

71 / 73 page

Package outline

STw5095

70/72

Package outline

Figure 33.

Package mechanical data

Note:

The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink

or metallized markings, or other feature of package body or integral heatslug. A

distinguishing feature is allowable on the bottom surface of the package to identify the

terminal A1 corner. Exact shape of each corner is optional.

Table 29.

Package dimensions (mm)

Ref.

Min.

Typ.

Max.

Outline and mechanical data

A (1)

The total profile height is measured from the seating plane to the top of the component.

1.010

1.200 (2)

Max mounted height is 1.12mm.Based on a 0.28mm ball pad diameter. Solder paste is 0.15mm thickness and 0.28mm

diameter.

0.150

0.820

0.250

0.300

0.350

4.850

5.000

5.150

3.500

4.850

5.000

5.150

3.500

0.450

0.500

0.550

0.600

0.750

0.900

TFBGA 5x5x1.20 64 F8x8 0.50

Thin Profile Fine Pitch Ball Grid Array

ddd

0.080

ddd

12345678

A1 CORNER INDEX AREA

Øb (64 BALLS)

PLANE

SEATING

BOTTOM VIEW

See

Note 1

STW5095 数据表(PDF) 71 Page - STMicroelectronics

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