MPC8313VRGDFA datasheet(85/100 Pages) FREESCALE

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MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2.1

Freescale Semiconductor

Thermal

RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to

change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat

sink, the airflow around the device, the interface material, the mounting arrangement on the printed-circuit

board, or change the thermal dissipation on the printed-circuit board surrounding the device.

To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been

simulated with a few commercially available heat sinks. The heat sink choice is determined by the

application environment (temperature, airflow, adjacent component power dissipation) and the physical

space available. Because there is not a standard application environment, a standard heat sink is not

required.

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in Table 71. More detailed thermal

models can be made available on request.

Table 71. Thermal Resistance for TEPBGAII with Heat Sink in Open Flow

Heat Sink Assuming Thermal Grease

Airflow

Thermal Resistance

(

°C/W)

Wakefield 53

× 53 × 2.5 mm pin fin

Natural convection

13.0

0.5 m/s

10.6

1 m/s

9.7

2 m/s

9.2

4 m/s

8.9

Aavid 35

× 31 × 23 mm pin fin

Natural convection

14.4

0.5 m/s

11.3

1 m/s

10.5

2 m/s

9.9

4 m/s

9.4

Aavid 30

× 30 × 9.4 mm pin fin

Natural convection

16.5

0.5 m/s

13.5

1 m/s

12.1

2 m/s

10.9

4 m/s

10.0

Aavid 43

× 41 × 16.5 mm pin fin

Natural convection

14.5

0.5 m/s

11.7

1 m/s

10.5

2 m/s

9.7

4 m/s

9.2

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