Preliminary Technical Data

ADIS16220

Rev. PrE | Page 15 of 16

APPLICATIONS INFORMATION

ASSEMBLY

The ADIS16220 is a system-in-package (SIP) that integrates

multiple components together in a land grid array (LGA). This

configuration offers the convenience of solder-reflow installation

on printed circuit boards (PCBs). In developing a process flow

for installing ADIS16220 devices on PCBs, refer to the follow-

ing industry standards: JEDEC J-STD-020 for solder reflow

temperature profiles and JEDEC J-STD-033 for moisture

sensitivity (MSL) handling requirements. The MSL rating for

these devices are clearly marked on the antistatic bags, which

protect these devices from ESD during shipping and handling.

Prior to assembly, review the process flow for opportunity to

introduce shock levels that exceed the ADIS16220’s absolute

maximum ratings. PCB separation (score and snap) and ultra-

sonic cleaning are two common areas that can introduce high

levels of shock to these devices.

INTERFACE BOARD

The ADIS16220/PCBZ provides the ADIS16220 function

on a 1.2 inch × 1.3 inch printed circuit board (PCB), which

simplifies the connection to an existing processor system.

The four mounting holes accommodate either M2 (2mm) or

Type 2-56 machine screws. These boards are made of IS410

material and are 0.063 inches thick. The second level assembly

uses a SAC305-compatible solder composition (Pb-free), which

has a presolder reflow thickness of approximately 0.005 inches.

The pad pattern on the ADIS16220/PCBZ matches that shown in

Figure 5. J1 and J2 are dual-row, 2 mm (pitch) connectors that

work with a number of ribbon cable systems, including 3M Part

Number 152212-0100-GB (ribbon-crimp connector) and 3M Part

Number 3625/12 (ribbon cable).

1

SCLK

2

DOUT

3

DIN

4

CS

13

VDD

9

RST

15

VREF

14

AIN1

12

AIN2

6

DIO2

5

DIO1

7

10

8

11

ADIS16220CCCZ

16

GND

NC

NC

NC

NC

1

2

3

4

6

10

11

7

8

12

5

9

J1

C1

1

3

11

12

6

10

7

8

5

9

J2

11

12

9

10

7

8

5

6

3

4

1

2

J1/J2 PIN NUMBERS

2

4

Figure 16. Electrical Schematic

iSensor

U1

J1

C1

J2

1.050

2 × 0.925

2 × 0.673

2 × 0.000

0.150

4 × Ø0.087

M2×0.4

a

Figure 17. PCB Assembly View and Dimensions