STM32F107VB datasheet(94/95 Pages) STMICROELECTRONICS

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Revision history

STM32F105xx, STM32F107xx

94/95

Doc ID 15274 Rev 4

14-Sep-2009

Document status promoted from Preliminary data to full datasheet.

Number of DACs corrected in Table 3: STM32F105xx and

STM32F107xx family versus STM32F103xx family.

Note 4 added in Table 5: Pin definitions.

VRERINT and TCoeff added to Table 12: Embedded internal reference

voltage.

Values added to Table 13: Maximum current consumption in Run

mode, code with data processing running from Flash, Table 14:

Maximum current consumption in Run mode, code with data

processing running from RAM and Table 15: Maximum current

consumption in Sleep mode, code running from Flash or RAM.

Typical IDD_VBAT value added in Table 16: Typical and maximum

current consumptions in Stop and Standby modes.

Figure 9: Typical current consumption on VBAT with RTC on vs.

temperature at different VBAT values added.

Values modified in Table 17: Typical current consumption in Run

mode, code with data processing running from Flash and Table 18:

Typical current consumption in Sleep mode, code running from Flash

or RAM.

fHSE_ext min modified in Table 20: High-speed external user clock

characteristics.

CL1 and CL2 replaced by C in Table 22: HSE 3-25 MHz oscillator

characteristics and Table 23: LSE oscillator characteristics (fLSE =

32.768 kHz), notes modified and moved below the tables. Note 1

modified below Figure 15: Typical application with an 8 MHz crystal.

Conditions removed from Table 26: Low-power mode wakeup

timings.

Standards modified in Section 5.3.10: EMC characteristics on

page 50, conditions modified in Table 31: EMS characteristics.

Jitter maximum values added to Table 27: PLL characteristics and

Table 28: PLL2 and PLL3 characteristics.

RPU and RPD modified in Table 35: I/O static characteristics.

Condition added for VNF(NRST) parameter in Table 38: NRST pin

characteristics. Note removed and RPD, RPU values added in

Table 45: USB OTG FS DC electrical characteristics.

Table 47: Ethernet DC electrical characteristics added.

Parameter values added to Table 48: Dynamics characteristics:

Ethernet MAC signals for SMI, Table 49: Dynamics characteristics:

Ethernet MAC signals for RMII and Table 50: Dynamics

characteristics: Ethernet MAC signals for MII.

CADC and RAIN parameters modified in Table 51: ADC

characteristics. RAIN max values modified in Table 52: RAIN max for

fADC = 14 MHz.

Table 55: DAC characteristics modified. Figure 33: 12-bit buffered

/non-buffered DAC added.

Table 62: Applicative current consumption in Run mode, code with

data processing running from Flash added.

Small text changes.

Table 63.

Document revision history (continued)

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