STM32F103C4T6ATR datasheet(69/80 Pages) STMICROELECTRONICS

部件名	STM32F103C4T6ATR

功能描述	Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces

PDF	80 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

69 / 80 page

STM32F103x4, STM32F103x6

Package characteristics

Doc ID 15060 Rev 3

69/80

Drawing is not to scale.

The back-side pad is not internally connected to the VSS or VDD power pads.

There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should

also be soldered to the PCB. It is recommended to connect it to VSS.

Figure 33.

VFQFPN36 6 x 6 mm, 0.5 mm pitch,

package outline(1)

Figure 34.

Recommended footprint

(dimensions in mm)(1)(2)(3)

Seating plane

ddd

Pin # 1 ID

R = 0.20

ZR_ME

0.30

6.30

0.50

1.00

4.30

4.80

4.10

ai14870b

0.75

Table 50.

VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.020

0.050

0.0008

0.0020

0.650

1.000

0.0256

0.0394

0.250

0.0098

0.180

0.230

0.300

0.0071

0.0091

0.0118

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

5.875

6.000

6.125

0.2313

0.2362

0.2411

1.750

3.700

4.250

0.0689

0.1457

0.1673

0.450

0.500

0.550

0.0177

0.0197

0.0217

0.350

0.550

0.750

0.0138

0.0217

0.0295

ddd

0.080

0.0031

Values in inches are converted from mm and rounded to 4 decimal digits.

STM32F103C4T6ATR 数据表(PDF) 69 Page - STMicroelectronics

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