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STM32F100V8H7B 数据表(PDF) 51 Page - STMicroelectronics |
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STM32F100V8H7B 数据表(HTML) 51 Page - STMicroelectronics |
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51 / 84 page ![]() STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Electrical characteristics Doc ID 16455 Rev 2 51/84 5.3.9 Memory characteristics Flash memory The characteristics are given at TA = –40 to 105 °C unless otherwise specified. Table 27. Flash memory characteristics Symbol Parameter Conditions Min(1) 1. Guaranteed by design, not tested in production. Typ Max(1) Unit tprog 16-bit programming time TA–40 to +105 °C 40 52.5 70 µs tERASE Page (1 KB) erase time TA –40 to +105 °C 20 40 ms tME Mass erase time TA –40 to +105 °C 20 40 ms IDD Supply current Read mode fHCLK = 24 MHz, VDD = 3.3 V 20 mA Write / Erase modes fHCLK = 24 MHz, VDD = 3.3 V 5mA Power-down mode / Halt, VDD = 3.0 to 3.6 V 50 µA Vprog Programming voltage 2 3.6 V Table 28. Flash memory endurance and data retention Symbol Parameter Conditions Value Unit Min(1) 1. Based on characterization not tested in production. Typ Max NEND Endurance TA = –40 to +85 °C (6 suffix versions) TA = –40 to +105 °C (7 suffix versions) 10 kcycles tRET Data retention 1 kcycle(2) at TA = 85 °C 2. Cycling performed over the whole temperature range. 30 Years 1 kcycle(2) at TA = 105 °C 10 10 kcycles(2) at TA = 55 °C 20 |
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