WM9708

Advanced Information

WOLFSON MICROELECTRONICS LTD

AI Rev 2.0 April 2001

28

PACKAGE DIMENSIONS

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.20MM.

D. MEETS JEDEC.95 MO-150, VARIATION = AH. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

DM007.C

DS: 28 PIN SSOP (10.2 x 5.3 x 1.75 mm)

Symbols

Dimensions

(mm)

MIN

NOM

MAX

A

-----

-----

2.0

0.05

-----

-----

1.62

1.75

1.85

b

0.22

-----

0.38

c

0.09

-----

0.25

D

9.90

10.20

10.50

e

0.65 BSC

E

7.40

7.80

8.20

5.00

5.30

5.60

L

0.55

0.75

0.95

θ

0

o

4

o

8

o

REF:

JEDEC.95, MO-150

A A2

A1

14

1

15

28

E1

E

Θ

c

L

GAUGE

PLANE

0.25

e

b

D

SEATING PLANE

-C-

0.10 C