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MF1S5009DA4 数据表(PDF) 2 Page - NXP Semiconductors |
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MF1S5009DA4 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 32 page ![]() MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3 — 27 July 2010 189131 2 of 32 NXP Semiconductors MF1S5009 Mainstream contactless smart card IC 1.4 Security • Unique identifier for each device using double size UID (7 byte UID) • Mutual three pass authentication (ISO/IEC 9798-2) • Individual set of two keys per sector (per application) to support multi-application with key hierarchy 1.5 Delivery options • Bumped die on wafer • MOA4 contactless module 2. Features and benefits 2.1 MIFARE‚ RF Interface (ISO/IEC 14443 A) Contactless transmission of data and supply energy (no battery needed) Operating distance up to 100 mm depending on antenna geometry and reader configuration Operating frequency of 13.56 MHz Data transfer of 106 kbit/s Data integrity of 16-bit CRC, parity, bit coding, bit counting Anticollision Typical ticketing transaction time of < 100 ms (including backup management) 2.2 EEPROM 1 kB, organized in 16 sectors with 4 blocks of 16 bytes each (one block consists of 16 byte) User definable access conditions for each memory block Data retention time of 10 years Write endurance 100000 cycles |
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