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MF1S5009DA4 数据表(PDF) 4 Page - NXP Semiconductors

部件名 MF1S5009DA4
功能描述  Mainstream contactless smart card IC for fast and easy solution development
PDF  32 Pages
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

MF1S5009DA4 数据表(HTML) 4 Page - NXP Semiconductors

  MF1S5009DA4 Datasheet HTML 1Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 2Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 3Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 4Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 5Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 6Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 7Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 8Page - NXP Semiconductors MF1S5009DA4 Datasheet HTML 9Page - NXP Semiconductors Next Button
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MF1S5009
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
PUBLIC
Rev. 3 — 27 July 2010
189131
4 of 32
NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
6.
Pinning information
6.1
Smart card contactless module
7.
Mechanical specification
Fig 3.
Contact assignments for SOT500-2 (MOA4)
Table 2.
Bonding pad assignments to smart card contactless module
Contactless interface module
MF1S5009DA4
Antenna contacts
Symbol
Description
LA
LA
Antenna coil connection LA
LB
LB
Antenna coil connection LB
001aam200
top view
LA
LB
Table 3.
Specifications
Wafer
diameter
200 mm typical (8 inches)
maximum diameter after foil expansion
210 mm
thickness
120
μm ± 15 μm
flatness
not applicable
Potential Good Dies per Wafer (PGDW)
18482
Wafer backside
material
Si
treatment
ground and stress relieve
roughness
Ra max = 0.2 μm
Rt max = 2 μm
Chip dimensions
step size
x = 1231
μm
y = 1280
μm



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