MF1S5009DA4 datasheet(6/32 Pages) NXP

部件名	MF1S5009DA4

功能描述	Mainstream contactless smart card IC for fast and easy solution development

PDF	32 Pages

Scroll/Zoom	100%

制造商	NXP [NXP Semiconductors]

网页	http://www.nxp.com

标志

6 / 32 page

MF1S5009

All information provided in this document is subject to legal disclaimers.

Product data sheet

PUBLIC

Rev. 3 — 27 July 2010

189131

6 of 32

NXP Semiconductors

MF1S5009

Mainstream contactless smart card IC

Chip orientation and bond pad locations

(1) The air gap may vary due to varying foil expansion

(2) Measured from outer sealring edge (see detail)

All dimensions in

μm

Fig 4.

Chip orientation and bond pad locations

001aam201

Bump size

LA, LB

VSS, TP1, TP2

Chip Step

1231(1)

x (

μm)

y (

μm)

1280(1)

TP1

TP2

VSS

typ. 15.0(1)

min. 5.0

typ. 36.4(1)(2)

min. 26.4

typ. 15.0(1)

min. 5.0

1071.0(2)

typ. 36.4(1)(2)

min. 26.4

1070.0(2)

52.3(2)

51.3(2)

239.2(2)

368.7(2)

556.6(2)

807.7(2)

1231.0(1)

1280.0(1)

52.9(2)

Dimensions in

μm

MF1S5009DA4 数据表(PDF) 6 Page - NXP Semiconductors

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