325 datasheet(4/82 Pages) INTEL

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Datasheet

5.2.3

PROCHOT# Signal Pin .......................................................................... 66

5.2.4

THERMTRIP# Signal Pin ....................................................................... 66

5.2.5

TCONTROL and Fan Speed Reduction (Optional) ................................... 67

5.2.6

Thermal Diode........................................................................................ 67

6Features ....................................................................................................................... 69

6.1

Power-On Configuration Options ........................................................................ 69

6.2

Clock Control and Low Power States.................................................................. 69

6.2.1

Normal State—State 1 ........................................................................... 69

6.2.2

AutoHALT Powerdown State—State 2 .................................................. 70

6.2.3

Stop-Grant State—State 3 ..................................................................... 71

6.2.4

HALT/Grant Snoop State—State 4 ........................................................ 71

6.2.5

Sleep State—State 5.............................................................................. 72

Boxed Processor Specifications ....................................................................... 73

7.1

Mechanical Specifications................................................................................... 74

7.1.1

Boxed Processor Cooling Solution Dimensions ..................................... 74

7.1.2

Boxed Processor Fan Heatsink Weight.................................................. 75

7.1.3

Boxed Processor Retention Mechanism and Heatsink

Attach Clip Assembly ............................................................................. 75

7.2

Electrical Requirements ...................................................................................... 76

7.2.1

Fan Heatsink Power Supply ................................................................... 76

7.3

Thermal Specifications........................................................................................ 77

7.3.1

Boxed Processor Cooling Requirements ............................................... 77

7.3.2

Variable Speed Fan ............................................................................... 79

Debug Tools Specifications................................................................................. 81

8.1

Logic Analyzer Interface (LAI)............................................................................. 81

8.1.1

Mechanical Considerations .................................................................... 81

8.1.2

Electrical Considerations........................................................................ 81

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