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STM32F103CBU6TR 数据表(PDF) 55 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 55 Page - STMicroelectronics |
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55 / 96 page ![]() STM32F103x8, STM32F103xB Electrical characteristics Doc ID 13587 Rev 12 55/96 Table 29. Flash memory endurance and data retention 5.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: ● Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard. ● FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant with the IEC 61000-4-4 standard. A device reset allows normal operations to be resumed. The test results are given in Table 30. They are based on the EMS levels and classes defined in application note AN1709. IDD Supply current Read mode fHCLK = 72 MHz with 2 wait states, VDD = 3.3 V 20 mA Write / Erase modes fHCLK = 72 MHz, VDD = 3.3 V 5mA Power-down mode / Halt, VDD = 3.0 to 3.6 V 50 µA Vprog Programming voltage 2 3.6 V 1. Guaranteed by design, not tested in production. Symbol Parameter Conditions Value Unit Min(1) 1. Based on characterization, not tested in production. Typ Max NEND Endurance TA = –40 to +85 °C (6 suffix versions) TA = –40 to +105 °C (7 suffix versions) 10 kcycles tRET Data retention 1 kcycle(2) at TA = 85 °C 2. Cycling performed over the whole temperature range. 30 Years 1 kcycle(2) at TA = 105 °C 10 10 kcycles(2) at TA = 55 °C 20 Table 28. Flash memory characteristics (continued) Symbol Parameter Conditions Min(1) Typ Max(1) Unit |
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