MSC8252 datasheet(24/68 Pages) FREESCALE

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MSC8252 Dual-Core Digital Signal Processor Data Sheet, Rev. 3

Electrical Characteristics

Freescale Semiconductor

2.2

Recommended Operating Conditions

Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.

2.3

Thermal Characteristics

Table 4 describes thermal characteristics of the MSC8252 for the FC-PBGA packages.

Table 3. Recommended Operating Conditions

Rating

Symbol

Min

Nominal

Max

Unit

Core supply voltage

VDD

0.97

1.0

1.05

M3 memory supply voltage

VDDM3

0.97

1.0

1.05

DDR memory supply voltage

• DDR2 mode

• DDR3 mode

DDR reference voltage

VDDDDR

MVREF

1.7

1.425

0.49

× VDDDDR

1.8

1.5

0.5

× VDDDDR

1.9

1.575

0.51

× VDDDDR

I/O voltage excluding DDR and

RapidIO lines

VDDIO

2.375

2.5

2.625

Rapid I/O pad voltage

VDDSXP

0.97

1.0

1.05

Rapid I/O core voltage

VDDSXC

0.97

1.0

1.05

Operating temperature range:

• Standard

• Higher

• Extended

–40

—

105

—

105

°C

Typical power: 1 GHz at 1.0 V1

—

3.54

—

Notes:

The typical power values are derived for a device running under the following conditions.

•

Two cores running at 1 GHz, Core voltage at 1V, 75% utilization (50% control/50% DSP).

•

A single 64 bit DDR3 running at 800 MHz, 50% utilization (50% reads/50% writes).

•

M3 Memory 50% utilized, PCI Express controller disabled, TDM enabled 20% loading, Serial RapidIO controller

disabled, 1 RGMII at 1 Gbps 50% loading.

•

A junction temperature of 60°C.

Table 4. Thermal Characteristics for the MSC8252

Characteristic

Symbol

FC-PBGA

× 29 mm2

Unit

Natural

Convection

200 ft/min

(1 m/s) airflow

Junction-to-ambient1, 2

RθJA

°C/W

Junction-to-ambient, four-layer board1, 2

RθJA

°C/W

Junction-to-board (bottom)3

RθJB

°C/W

Junction-to-case4

RθJC

0.6

°C/W

Notes:

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESDC51-6. Thermal test board meets JEDEC

specification for the specified package.

Junction-to-board thermal resistance determined per JEDEC JESD 51-8. Thermal test board meets JEDEC specification for

the specified package.

Junction-to-case at the top of the package determined using MIL- STD-883 Method 1012.1. The cold plate temperature is used

for the case temperature. Reported value includes the thermal resistance of the interface layer

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