STM8L15 datasheet(103/122 Pages) STMICROELECTRONICS

103 / 122 page

STM8L151xx, STM8L152xx

Electrical parameters

Doc ID 15962 Rev 5

103/122

fCONV

12-bit conversion rate

VAIN on PF0 fast

channel

1(4)(5)

MHz

VAIN on all other

channels

760(4)(5)

kHz

fTRIG

External trigger

frequency

tconv

1/fADC

tLAT

External trigger latency

3.5

1/fSYSCLK

Sampling time

VAIN on PF0 fast

channel

VDDA < 2.4 V

0.43(4)(5)

µs

VAIN on PF0 fast

channel

2.4 V

≤VDDA≤ 3.6 V

0.22(4)(5)

µs

VAIN on slow channels

VDDA < 2.4 V

0.86(4)(5)

µs

VAIN on slow channels

2.4 V

≤VDDA≤ 3.6 V

0.41(4)(5)

µs

tconv

12-bit conversion time

12 + tS

1/fADC

16 MHz

1(4)

µs

tWKUP

Wakeup time from OFF

state

3µs

tIDLE

(6)

Time before a new

conversion

TA = +25 °C

TA = +70 °C

TA = +125 °C

tVREFINT

Internal reference

voltage startup time

refer to

Table 44

Data guaranteed by design, not tested in production.

The current consumption through VREF is composed of two parameters:

- one constant (max 300 µA)

- one variable (max 400 µA), only during sampling time + 2 first conversion pulses.

So, peak consumption is 300+400 = 700 µA and average consumption is 300 + [(4 sampling + 2) /16] x 400 = 450 µA at

1Msps

VREF- or VDDA must be tied to ground.

Minimum sampling and conversion time is reached for maximum Rext = 0.5 k

Ω..

Value obtained for continuous conversion on fast channel.

The time between 2 conversions, or between ADC ON and the first conversion must be lower than tIDLE.

Table 51.

ADC1 characteristics (continued)

Symbol

Parameter (1)

Conditions

Min (1)

Typ(1)

Max(1)

Unit

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