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80310 数据表(PDF) 27 Page - Freescale Semiconductor, Inc |
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80310 数据表(HTML) 27 Page - Freescale Semiconductor, Inc |
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27 / 31 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 27 80310 PACKAGING DIE DIMENSIONS PACKAGING DIE DIMENSIONS Notes 27. Both Signal and Power Grounds must be connected for correct operation. Pad Function Die Coordinates (Origin at Center of Die) X/ μm Y/ μm 1 PH2 2166 2158 2 PH1 2098 1217 3 BUS -1989 834 4 SIGNAL GROUND(27) -1989 0 5 B + A 1179 -840 6 EXC 1179 -1987 7 POWER GROUND(27) -367 -2631 PH1 6080 μm PH2 5050 μm Y Axis ORIGIN (0,0) X Axis 1 2 3 4 5 6 7 B + A EXC PGND SGND BUS SCALE = Approximately 20:1 |
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