Analog Integrated Circuit Device Data

28

Freescale Semiconductor

80310

PACKAGING

DIE CHARACTERISTICS

DIE CHARACTERISTICS

The die is designed to be fitted into a customer designed package, however as so many wiring configurations exist not all

may be possible from the same die design. Due to thermal considerations, soldering is the preferred die attach method, but under

some circumstances, conductive epoxy may be acceptable.

Table 16. Physical Die Characteristics.

Mechanical data

Length

Width

Units

Main Bonding Pad Size (200

μm wire)

0.66

0.5

mm

Die Size (Length x Width)

6.08

5.05

mm

Die Thickness

0.36

N/A

mm

Die Back Metal Composition

Cr/CrAg/Ag

N/A

N/A

Die Back Metal Thickness, Typical

2.1

N/A

μm

Die Top Metal Thickness, Typical

2.0

N/A

μm

Die Top Metal Composition

99.5 Al

0.5 Cu

%