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STTS2002B2DN3F 数据表(PDF) 46 Page - STMicroelectronics |
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STTS2002B2DN3F 数据表(HTML) 46 Page - STMicroelectronics |
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46 / 52 page ![]() Package mechanical data STTS2002 46/52 Doc ID 15389 Rev 5 The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN) are shown in Figure 18. The preferred implementation with wide corner pads enhances device centering during assembly, but a narrower option is defined for modules with tight routing requirements. Figure 18. Landing pattern - TDFN8 package (DN) e/2 e/2 e2 K K E2/2 E2/2 E2 D2/2 D2 D2/2 L L e b b b2 b4 K2 K2 K2 E3 E3 e4 ai14000 |
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