STTS2002B2DN3F datasheet(47/52 Pages) STMICROELECTRONICS

47 / 52 page

STTS2002

Package mechanical data

Doc ID 15389 Rev 5

47/52

Table 32 lists variations of landing pattern implementations, ranked as “Preferred” and

Minimum Acceptable” based on the JEDEC proposal.

Table 32.

Parameters for landing pattern - TDFN8 package (DN)

Parameter

Description

Dimension

Min

Nom

Max

Heat paddle width

1.40

1.60

Heat paddle height

1.40

1.60

Heat paddle centerline to contact inner locus

1.00

Contact length

0.70

0.80

Heat paddle to contact keepout

0.20

Contact to contact keepout

0.20

Contact centerline to contact centerline pitch for inner contacts

0.50

Contact width for inner contacts

0.25

0.30

Landing pattern centerline to outer contact centerline, “minimum

acceptable” option(1)

-0.50-

Corner contact width, “minimum acceptable option”(1)

0.25

0.30

Landing pattern centerline to outer contact centerline, “preferred”

option(2)

-0.60-

Corner contact width, “preferred” option(2)

0.45

0.50

Minimum acceptable option to be used when routing prevents preferred width contact.

Preferred option to be used when possible.

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