PRELIMINARY TECHNICAL DATA

-20-

4/01/2002 REV. PrG

AD9430

100-Lead TQFP (with Exposed Heat Sink)

(TQFP-100)

7

0

0.011 (0.27)

0.009 (0.22)

0.007 (0.17)

0.0197 (0.50)

BSC

0.041 (1.05)

0.039 (1.00)

0.037 (0.95)

TOP VIEW

(PINS DOWN)

1

25

26

49

76

100

75

50

0.551 (14.00) SQ

0.630 (16.00) SQ

0.030 (0.75)

0.024 (0.60)

0.018 (0.45)

SEATING

PLANE

0.047 (1.20)

MAX

0.006 (0.15)

0.002 (0.05)

BOTTOM VIEW

1

25

26

49

76

100

75

50

CONDUCTIVE

HEAT SINK

0.260 (6.00) NOM

CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

CENTER FIGURES ARE TYPICAL UNLESS

OTHERWISE NOTED.

NOTE:

THE AD9430 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF

THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL

TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE

SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE

WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Troubleshooting

If the board does not seem to be working correctly, try the following:

• Verify power at IC pins.

• Check that all jumpers are in the correct position for the

desired mode of operation.

• Verify VREF is at 1.23 V.

• Try running Encode Clock and Analog Inputs at low speeds

(10 MSPS/1 MHz) and monitor 574, DAC, and ADC outputs

for toggling.

The AD9430 Evaluation Board is provided as a design example

for customers of Analog Devices, Inc. ADI makes no warranties,

express, statutory, or implied, regarding merchantability or

fitness for a particular purpose.