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MMDF2C01HD 数据表(PDF) 1 Page - Motorola, Inc |
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MMDF2C01HD 数据表(HTML) 1 Page - Motorola, Inc |
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1 / 12 page ![]() 1 Motorola TMOS Power MOSFET Transistor Device Data Designer's™ Data Sheet Medium Power Surface Mount Products Complementary TMOS Field Effect Transistors MiniMOS ™ devices are an advanced series of power MOSFETs which utilize Motorola’s High Cell Density HDTMOS process. These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery time. MiniMOS devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. • Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Logic Level Gate Drive — Can Be Driven by Logic ICs • Miniature SO–8 Surface Mount Package — Saves Board Space • Diode Is Characterized for Use In Bridge Circuits • Diode Exhibits High Speed, With Soft Recovery • IDSS Specified at Elevated Temperature • Mounting Information for SO–8 Package Provided MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)(1) Rating Symbol Value Unit Drain–to–Source Voltage N–Channel P–Channel VDSS 20 12 Vdc Gate–to–Source Voltage VGS ± 8.0 Vdc Drain Current — Continuous N–Channel P–Channel — Pulsed N–Channel P–Channel ID IDM 5.2 3.4 48 17 A Operating and Storage Temperature Range TJ and Tstg – 55 to 150 °C Total Power Dissipation @ TA= 25°C (2) PD 2.0 Watts Thermal Resistance — Junction to Ambient (2) R θJA 62.5 °C/W Maximum Lead Temperature for Soldering Purposes, 1/8 ″ from case for 10 seconds. TL 260 °C DEVICE MARKING D2C01 (1) Negative signs for P–Channel device omitted for clarity. (2) Mounted on 2” square FR4 board (1” sq. 2 oz. Cu 0.06” thick single sided) with one die operating, 10 sec. max. ORDERING INFORMATION Device Reel Size Tape Width Quantity MMDF2C01HDR2 13 ″ 12 mm embossed tape 2500 units Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. HDTMOS and MiniMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company. Order this document by MMDF2C01HD/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA © Motorola, Inc. 1996 D S G P–Channel D S G N–Channel CASE 751–05, Style 14 SO–8 MMDF2C01HD COMPLEMENTARY DUAL TMOS POWER FET 2.0 AMPERES 12 VOLTS RDS(on) = 0.045 OHM (N–CHANNEL) RDS(on) = 0.18 OHM (P–CHANNEL) Motorola Preferred Device ™ N–Source 1 2 3 4 8 7 6 5 Top View N–Gate P–Source P–Gate N–Drain N–Drain P–Drain P–Drain Preferred devices are Motorola recommended choices for future use and best overall value. REV 5 |
类似零件编号 - MMDF2C01HD |
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类似说明 - MMDF2C01HD |
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