STM32F103CBT6 datasheet(82/102 Pages) STMICROELECTRONICS

82 / 102 page

Package characteristics

STM32F103x8, STM32F103xB

82/102

Doc ID 13587 Rev 14

Drawing is not to scale.

All leads/pads should also be soldered to the PCB to improve the lead solder joint life.

Figure 43.

VFQFPN48 7 x 7 mm, 0.5 mm pitch, package

outline(1)

Figure 44.

Recommended footprint

(dimensions in mm)(1)(2)

Seating

Plane

Pin no. 1 ID

R = 0.20

Bottom View

V0_ME

0.50

7.30

0.75

5.80

6.20

5.60

ai15799

0.55

0.30

0.20

Table 52.

VFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.800

0.900

1.000

0.0315

0.0354

0.0394

0.020

0.050

0.0008

0.0020

0.650

1.000

0.0256

0.0394

0.250

0.0098

0.180

0.230

0.300

0.0071

0.0091

0.0118

6.850

7.000

7.150

0.2697

0.2756

0.2815

2.250

4.700

5.250

0.0886

0.1850

0.2067

6.850

7.000

7.150

0.2697

0.2756

0.2815

2.250

4.700

5.250

0.0886

0.1850

0.2067

0.450

0.500

0.550

0.0177

0.0197

0.0217

0.300

0.400

0.500

0.0118

0.0157

0.0197

ddd

0.080

0.0031

Values in inches are converted from mm and rounded to 4 decimal digits.

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