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STM32F103CBT6 数据表(PDF) 88 Page - STMicroelectronics |
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STM32F103CBT6 数据表(HTML) 88 Page - STMicroelectronics |
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88 / 102 page ![]() Package characteristics STM32F103x8, STM32F103xB 88/102 Doc ID 13587 Rev 14 Figure 52. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. Table 57. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 1.200 0.0472 A1 0.150 0.0059 A2 0.785 0.0309 A3 0.200 0.0079 A4 0.600 0.0236 b 0.250 0.300 0.350 0.0098 0.0118 0.0138 D 4.850 5.000 5.150 0.1909 0.1969 0.2028 D1 3.500 0.1378 E 4.850 5.000 5.150 0.1909 0.1969 0.2028 E1 3.500 0.1378 e 0.500 0.0197 F 0.750 0.0295 ddd 0.080 0.0031 eee 0.150 0.0059 fff 0.050 0.0020 A3 A4 A2 A1 A Seating plane B A D D1 e F F E1 E e H G F E D C B A 12 3 4567 8 A1 ball pad corner Øb (64 balls) Bottom view C ME_R8 |
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