MCP6482-ESLASHMS datasheet(45/50 Pages) MICROCHIP

45 / 50 page

 2012-2013 Microchip Technology Inc.

DS20002322C-page 45

MCP6481/2/4

APPENDIX A:

REVISION HISTORY

Revision C (June 2013)

The following is the list of modifications:

Added new devices to the family (MCP6482 and

MCP6484) and related information throughout

the document.

Updated

thermal

package

resistance

information in Table 1-3.

Added Figure 2-35 in Section 2.0, Typical Per-

formance Curves.

Updated Section 3.0, Pin Descriptions.

Added new Section 4.5, Unused Op Amps.

Updated the list of reference documents in

Section 5.5, Application Notes.

Added package markings and drawings for the

MCP6482 and MCP6484 devices.

Updated Product Identification System.

Revision B (October 2012)

The following is the list of modifications:

Updated the maximum low input offset voltage

value in the Section “Features”.

Updated the minimum and maximum input

offset voltage in Table 1-1 “DC Electrical

Specifications”.

Replaced

FIGURE

2-1:

“Input

Offset

Voltage.”

Revision A (September 2012)

• Original Release of this Document.

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