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MCP6482-E/MS 数据表(PDF) 17 Page - Microchip Technology |
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MCP6482-E/MS 数据表(HTML) 17 Page - Microchip Technology |
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17 / 50 page ![]() 2012-2013 Microchip Technology Inc. DS20002322C-page 17 MCP6481/2/4 4.5 Unused Op Amps An unused op amp in a quad package (MCP6484) should be configured as shown in Figure 4-6. These circuits prevent the output from toggling and causing crosstalk. Circuit A sets the op amp at its minimum noise gain. The resistor divider produces any desired reference voltage within the output voltage range of the op amp, and the op amp buffers that reference voltage. Circuit B uses the minimum number of components and operates as a comparator, but it may draw more current. FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage In applications where low-input bias current is critical, PCB surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low-humidity conditions, a typical resistance between nearby traces is 1012 . A 5V difference would cause 5 pA of current to flow, which is greater than the MCP6481/2/4 family’s bias current at +25°C (1 pA, typical). The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin. An example of this type of layout is shown in Figure 4-7. FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 1. Non-Inverting Gain and Unity-Gain Buffer: a.Connect the non-inverting pin (VIN+) to the input with a wire that does not touch the PCB surface. b.Connect the guard ring to the inverting input pin (VIN–). This biases the guard ring to the Common mode input voltage. 2. Inverting Gain and Transimpedance Gain Amplifiers (convert current to voltage, such as photo detectors): a.Connect the guard ring to the non-inverting input pin (VIN+). This biases the guard ring to the same reference voltage as the op amp (e.g., VDD/2 or ground). b.Connect the inverting pin (VIN–) to the input with a wire that does not touch the PCB surface. VDD VDD R1 R2 VDD VREF V REF V DD R 2 R 1 R 2 + -------------------- = ¼ MCP6484 (A) ¼ MCP6484 (B) Guard Ring VIN–VIN+ VSS |
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