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MCP6482-E/MS 数据表(PDF) 13 Page - Microchip Technology

部件名 MCP6482-E/MS
功能描述  4 MHz, Low-Input Bias Current Op Amps
PDF  50 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

MCP6482-E/MS 数据表(HTML) 13 Page - Microchip Technology

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 2012-2013 Microchip Technology Inc.
DS20002322C-page 13
MCP6481/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
3.1
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
Analog Inputs
The
non-inverting
and
inverting
inputs
are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.2V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in single-supply
operation. In this case, VSS is connected to ground and
VDD is connected to the supply. VDD will need bypass
capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA).
TABLE 3-1:
PIN FUNCTION TABLE
MCP6481
MCP6482
MCP6484
Symbol
Description
SC70, SOT-23
SOIC, MSOP
2x3 TDFN
SOIC, TSSOP
11
1
1
VOUT, VOUTA
Analog Output (op amp A)
42
2
2
VIN–, VINA
Inverting Input (op amp A)
33
3
3
VIN+, VINA+
Non-inverting Input (op amp A)
58
8
4
VDD
Positive Power Supply
—5
5
5
VINB+
Non-inverting Input (op amp B)
—6
6
6
VINB
Inverting Input (op amp B)
—7
7
7
VOUTB
Analog Output (op amp B)
——
8
VOUTC
Analog Output (op amp C)
——
9
VINC
Inverting Input (op amp C)
——
10
VINC+
Non-Inverting Input (op amp C)
24
4
11
VSS
Negative Power Supply
——
12
VIND+
Non-Inverting Input (op amp D)
——
13
VIND
Inverting Input (op amp D)
——
14
VOUTD
Analog Output (op amp D)
9
EP
Exposed Thermal Pad (EP);
must be connected to VSS.



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