STM8S003F3U6CTR datasheet(94/100 Pages) STMICROELECTRONICS

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Thermal characteristics

The maximum chip junction temperature (TJ max) must never exceed the values given in

Operating conditions.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using

the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

• TAmax is the maximum ambient temperature in °C

• ΘJA is the package junction-to-ambient thermal resistance in °C/W

• PDmax is the sum of PINTmax and PI/Omax(PDmax = PINTmax + PI/Omax)

• PINTmax is the product of IDDandVDD, expressed in Watts. This is the maximum chip internal

power.

• PI/Omax represents the maximum power dissipation on output pins

Where: PI/Omax =Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and

VOH/IOH of the I/Os at low and high level in the application.

Table 54: Thermal characteristics

Unit

Value

Parameter

(1)

Symbol

°C/W

Thermal resistance junction-ambient

TSSOP20 - 4.4 mm

ΘJA

Thermal resistance junction-ambient

ΘJA

UFQFPN20 - 3 x 3 mm

Thermal resistance junction-ambient

LQFP32 - 7 x 7 mm

ΘJA

(1)Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural

convection environment.

Reference document

11.1

JESD51-2 integrated circuits thermal test method environment conditions - natural convection

(still air). Available from www.jedec.org.

Selecting the product temperature range

11.2

When ordering the microcontroller, the temperature range is specified in the order code.

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Thermal characteristics

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