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PCF8564AU/5BB/1 数据表(PDF) 37 Page - NXP Semiconductors |
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PCF8564AU/5BB/1 数据表(HTML) 37 Page - NXP Semiconductors |
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37 / 48 page ![]() PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 3 — 26 August 2013 37 of 48 NXP Semiconductors PCF8564A Real time clock and calendar [1] Pressure of diamond head: 10 g to 50 g. Table 34. Pin location of all PCF8564A types All x/y coordinates represent the position of the center of each pin with respect to the center (x/y = 0) of the chip; see Figure 27 and Figure 28. Symbol Pad X ( m) Y ( m) Description OSCI 1 523.0 689.4 oscillator input OSCO 2 523.0 469.4 oscillator output INT 3 523.0 429.8 open-drain interrupt output (active LOW) VSS 4 523.0 684.4 ground (substrate) SDA 5 524.9 523.8 serial data I/O SCL 6 524.9 138.6 serial clock input CLKOUT 7 524.9 162.5 CMOS push-pull clock output VDD 8 524.9 443.3 supply CLKOE 9 524.9 716.3 CLKOUT output enable Fig 29. Alignment marks of all PCF8564A types Table 35. Alignment marks of all PCF8564A types All x/y coordinates represent the position of the REF point (see Figure 29) with respect to the center (x/y = 0) of the chip; see Figure 27 and Figure 28. Alignment markers Size ( m) X ( m) Y ( m) C1 100 100 465.2 826.3 C2 100 100 523.0 890.0 F90 117 569.9 885.5 Table 36. Gold bump hardness Type number Min Max Unit[1] PCF8564AUG/12HB/1 35 80 HV |
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