PCF8564AUSLASH5BBSLASH1 datasheet(45/48 Pages) NXP

45 / 48 page

PCF8564A

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 26 August 2013

45 of 48

NXP Semiconductors

PCF8564A

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Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Bare die — All die are tested on compliance with their related technical

specifications as stated in this data sheet up to the point of wafer sawing and

are handled in accordance with the NXP Semiconductors storage and

transportation conditions. If there are data sheet limits not guaranteed, these

will be separately indicated in the data sheet. There are no post-packing tests

performed on individual die or wafers.

NXP Semiconductors has no control of third party procedures in the sawing,

handling, packing or assembly of the die. Accordingly, NXP Semiconductors

assumes no liability for device functionality or performance of the die or

systems after third party sawing, handling, packing or assembly of the die. It

is the responsibility of the customer to test and qualify their application in

which the die is used.

All die sales are conditioned upon and subject to the customer entering into a

written die sale agreement with NXP Semiconductors through its legal

department.

23.4

Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

I2C-bus — logo is a trademark of NXP B.V.

24. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

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